(ANSA) – ROME, JUN 13 – The need to change smartphones or PCs every time to replace them with new models could become a memory: this is promised by the new chips for artificial intelligence which, like Lego bricks, can be hooked up to existing processors , updating them and thereby reducing electronic waste. This is made possible by a new type of chip developed by researchers at the Massachusetts Institute of Technology (MIT) described in Nature Electronics. Electronic waste is an increasingly serious problem because recycling the many materials present inside the chips and various devices are very difficult to extract and be reused. A solution could then come from the limitation of waste, in trying to extend the operating life of the devices as much as possible by making them updateable, also from the point of view of the hardware or the physical structure. In this perspective come the new chips designed by MIT researchers that are thought ‘in layers’, that is elementary chips or sensors that can be stacked and able to communicate with each other without using wires (difficult to connect) but using light, through pulses produced. by microscopic LEDs. ‘You can add as many processing levels and sensors as you like,’ said Jihoon Kang, one of the creators. ‘We call it a reconfigurable Artificial Intelligence chip similar to Legos because it has unlimited expandability depending on the combination of levels’. As well as the well-known children’s building bricks, the components can be mixed, added or removed at will, according to the needs with modules also designed for specific applications. (HANDLE).
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